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                精品推薦 | SKD-308H平移式分選機,功能再升級!


                2023-10-11 17:25

                 


                優點優勢
                Advantages

                 

                 

                精確定位,“穩如泰山”

                 

                 

                 

                 

                測試頭采用精密浮動機構,測試Arm的Y軸單獨驅動,可快速精確之定位,避免組件損傷,達到穩定之高良率。

                 

                The testing head adopts a precision floating mechanism, and the Y-axis of the testing Arm is driven alone. It can quickly and accurately locate, avoid component damage and achieve stable high yield.

                 

                 


                兼容性強,實惠省時

                 

                 

                 

                 

                 

                進料盤組件采用電機頂升結構,適應不同厚度規格料盤。tray移載機構兼容各種不同規格tray盤,針對各種IC封裝MSOP / QFN / QFP / SIM / LGA / BGA / CSP,3X3mm到大材料55X55mm等。

                 

                The feed tray assembly adopts the motor lifting structure to adapt to the different thickness specifications of the feed tray. Tray transfer mechanism is compatible with various specifications of tray tray, MSOP / QFN / QFP / SIM / LGA / BGA / CSP, 3X3mm to 55X55mm for various IC packages.

                 

                 


                小型設計,更省空間

                 

                 

                 

                 

                 

                全機采用模塊化設計,達到小型,省空間之要求。

                 

                The whole machine adopts Modular design, to achieve small, space-saving requirements.

                 

                 

                 


                Y軸雙驅,精度高,晃動小

                 

                 

                 

                 

                 

                上下料手臂Y軸雙驅,精度更高,晃動更小。

                 

                Upper and lower material arm Y-axis double drive, higher precision, less sway.

                 

                 


                功能“2+1”,2自動+1檢測

                 

                 

                 

                 

                 

                具備自動校高,自動計算測壓力,socket疊料檢測功能。

                 

                With automatic height, automatic calculation of pressure, socket stack detection function.

                 

                 


                可自動清理組件,省時又省力

                 

                 

                 

                 

                 

                配備自動清潔組件,達到設定值后自動清理測試探針。

                 

                Equipped with an automatic cleaning component, the test probe is automatically cleaned after the set value is reached.

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